对MC68HC711E9MFNE2单片机解密，首先需要对单片机本身的基本性能及其内部加密特征与结构有一定的了解，如果客户有MC68HC711E9MFNE2单片机需要解密，对该单片机有一定的了解能够更好的对解密项目进行沟通和控制，特别是对解密难易以及解密报价上自己能够做到心里有数。
　　邦凯在提供单片机解密/IC芯片解密等同时，一般会为客户提供各类单片机解密的技术支持与沟通，对每一款IC芯片其加解密原理及我们通常采用的解密手法，以及解密的难易程度和报价规则，我们都会向客户说明。
　　这里仅提供对MC68HC711E9MFNE2单片机的基本介绍，有MC68HC711E9MFNE2单片机解密需求者请与邦凯芯片解密研究所联系咨询更多解密详情

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　　MC68HC711E9MFNE2单片机基本介绍：
　　M68HC11 CPU
　　Power-saving stop and wait modes
　　Low-voltage devices available (3.0–5.5 Vdc)
　　0, 256, 512, or 768 bytes of on-chip RAM, data retained during standby
　　0, 12, or 20 Kbytes of on-chip ROM or EPROM
　　0, 512, or 2048 bytes of on-chip EEPROM with block protect for security
　　2048 bytes of EEPROM with selectable base address in the MC68HC811E2
　　Asynchronous non-return-to-zero (NRZ) serial communications interface(SCI)
　　Additional baud rates available on MC68HC(7)11E20
　　Synchronous serial peripheral interface (SPI)
　　8-channel, 8-bit analog-to-digital (A/D) converter
　　16-bit timer system:
　　– Three input capture (IC) channels
　　– Four output compare (OC) channels
　　– One additional channel, selectable as fourth IC or fifth OC
　　8-bit pulse accumulator
　　Real-time interrupt circuit
　　Computer operating properly (COP) watchdog system
　　38 general-purpose input/output (I/O) pins:
　　– 16 bidirectional I/O pins
　　– 11 input-only pins
　　– 11 output-only pins
　　Several packaging options:
　　– 52-pin plastic-leaded chip carrier (PLCC)
　　– 52-pin windowed ceramic leaded chip carrier (CLCC)
　　– 52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
　　– 64-pin quad flat pack (QFP)
　　– 48-pin plastic dual in-line package (DIP), MC68HC811E2 only
　　– 56-pin plastic shrink dual in-line package, .070-inch lead spacing (SDIP)